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EMI Shielding Technology
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Max Plate
    PVD Physical Vapor Deposition
TennVac offers the traditional Aluminium deposition, but in recent months has seen a clear shift to the more effective Copper/ Nickel system. The higher performance combined with
a better long-term stability can be applied single or double sided. Another breakthrough is the application of such layers on pre-formed thin films at a very attractive price in a relatively short leadtime. At customer wish, these EMI-shields can be supplied with or without EMI-gasket.
◎Measurements: Transistion resistor in Ohm.
Layer-Layer
Layer-Gasket
Gasket-Gasket
Al 5,5
<0,20
<0,60
0,15 .. 0,30
Cu 4
<0,05
<0,20
0,03 .. 0,20
Zn 150
<0,02
<0,04
0,03 .. 0,07
Ag - Conduct Varnish
<0,08
<0,10
0,08 .. 0,20
※ Source: Costumer data, single sided shielding
•Metals:
   - Cu/Ni-Cr
   - Al/Ag/Au
•Superior Conductivity - Below 0.2 ohm-cm
•Low Cost
•Environmental friendly
•Applications:
   - Mobile Phone/PDA
   - Notebook
   - Portable Electronics
   - Medical
   - Automotive
   - Antenna's
   - Cosmetic
   - Reflective
   - Flex Assemblies
   - Foam
   - Conductive Pads (Mylar)
   - Circuits
   - Grounding
 
How it works
 
Comparison
Electrical Conductivity
(*ohms per square)
Shielding Effectiveness
Thickness
Adhesion / Cohesion
Weight
Cost
Sheet Metal
0.05 - 0.15
80db - 95db
5.0
N/A
High
Med
Electroless Nickel
0.01 - 0.03
75db - 95db
3.0
Excellent
Med
High
Conductive Paint
0.20 - 0.50
55db - 70db
3.0
Moderate
High
Med
Vacuuum Metallization
0.05 - 0.20
60db - 80db
2.15
Standard
Excellent
1.0 Grams/
Sq. Ft.
Low
※ OHMS Per Square - A reading of 0.20 ohm/sq is approximately 50-60dB of shielding effectiveness
 
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