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Thermal Management Technology
Max Grease
Thermal Silicone Grease
Key Features
•Thermally conductive silicone
•Low bleeding
•Good wetting
•Slow flow
•Stable in high temperature , up to 200oC
Products
•High thermal K grease
•Moderate thermal K grease
•General thermal K grease
Applications
•CPU & Chip Coolers
•Switching power supplies
•Home Appliances
•LED
Typical Property
Test method
Thermal Conductive Silicone Compunds
TSG100
TSG200
TSG500
Color
----
White
White
Grey
Thermal Conductivity(W/m-K)
----
1.4
0.85
4
.2
Thermal Impedance@15psi
----
0.30
0.28
0.13
Continuous Use Temp °C
ASTM D 149
-45~200
-45~200
-40~150
Specific Gravity
----
2.5
2.5
2.65
Filler
----
Metal Oxide
Metal Oxide
Metal Oxide
Application
----
BGA package for VGA card
Laptop CPU or Flip Chip card or general application
Highest thermal performance, Destop/Laptop CPU sink,LED
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Copyright 2004 © TennMax Inc. All Rights Reserved
ADD:9F-2. NO. 31-1, Lane 169, Kang-Ning St., Hsi-Chih City, Taipei-Hsien, Taiwan R.O.C.
TEL:886-2-2695-4137 FAX:886-2-2695-4138 Email
:
Sales@tennmax.com.tw